Overview
The Bruker Dektak 150 uses a diamond-tipped stylus to trace surface topography. Surface roughness and step heights can be easily measured, and the stress analysis upgrade allows one to determine wafer stress due to film deposition.
Capabilities
- Measurement Technique: contact stylus profilometry
- Measurement Capability: two-dimensional surface profile measurements
- Sample Viewing 640 x 480-pixel (1/3 in.-format) camera
- Stylus Sensor Low-Inertia Sensor (LIS 3)
- Stylus Force 1 to 12 mg with LIS 3 sensor
- Stylus radius: 12.5 μm
- Sample Stage Manual X/Y/, 100 x 100 mm X-Y translation, 360° rotation, manual leveling
- Scan Length Range: 55 mm
- Data Points Per Scan 120,000 maximum
- Sample Thickness Up to 90 mm
- Wafer Size: 150 mm
- Step Height Repeatability: 6 Å
- Vertical Range 524 μm
- Vertical Resolution 1 Å max. (at 6.55 μm range)
Contact
-
Dr. Dmitry Koktysh
VINSE Analytical Laboratory
- 107 Engineering Science Building