Overview
The AJA ATC-2200 system is a versatile physical vapor deposition system used to deposit and co-deposit insulators, semiconductors, and metals through DC and RF sputtering.
Capabilities
- 4 ST-30 HV sputtering sources with 75 mm targets
- Sputter up setup - sample sits at the top of the chamber
- Co-deposition capabilities (up to 2 RF + 1 DC simultaneously)
- Current deposition materials:
- Ag, Al, Al2O3, Cr, Cu, Ge, HfO2, ITO (In2O3/SnO2 target), KTN (Potassium Tantalate Niobate), LiO2, Mg, Ni, Si, Si3N4, SiO2, Ti, TiO2, V, VOx, W, Y2O3
- Co-sputtering recipes available: CrV, Ag99Al01
- Additional materials available upon request
- Process gasses: Argon, N2, O2
- Sample holder rotation
- Sample size:
- 5.55 inch (14 cm) diameter region for mounting samples on flat sample holders
- Wafer holders are available for 3 inch (75 mm) and 4 inch (100 mm) wafers
- Sample heating available up to 800°C
- PID loop and manual control capabilities during deposition
- Sample load lock reaches base pressure after 5 minute pump down
Contact
-
VINSE Cleanroom
Dr. Ben Schmidt, Manager
Dr. Christina McGahan
Megan Dernberger- 111 Engineering Science Building