Rapid Thermal Processor

SSI Solaris 150

Overview

RTE
A Scanning Electron Microscope (SEM) image of a metal stack creating metal islands after alloying. Fabricated with the Karl Suss MA-6 Mask Aligner, Anstrom Amod Multimode Deposition Chamber, and the SSI Solaris 150 Rapid Thermal Processor in the VINSE Cleanroom. Imaged in the VINSE facilities using the Zeiss Merlin Scanning Electron Microscope. (Owen Meilander, Ebrish Group)

The Solaris 150 Rapid Thermal Processor (Surface Science Integration, Inc.) is a manual loading RTP system for R&D and pre-production.  The unique temperature measurement system of the Solaris 150 requires virtually no calibration for different wafer types and backside emissivity differences.  The Solaris 150 uses a unique PID process controller that ensures accurate temperature stability and uniformity. 

Capabilities

  • Total dimensions: 21.5” x 23” x 10.5” (remove this line!)
  • Wafer handling: manual load, single wafer processing
  • Wafer sizes: 2”, 3”, 4”, and 6” wafers
    • 4” wafer carrier available for smaller pieces
  • Temperature: room temperature - 1200°C
    • Thermocouple accuracy: + 2.5°C
    • Temperature uniformity: +5°C across 6” wafer at 1150°C
    • Temperature repeatability: + 3°C or better at 1150°C
  • Process gasses:
    • Ar and N2
See All User Fees

Contact

  • VINSE Cleanroom

    VINSE Cleanroom

    Dr. Ben Schmidt, Manager

    Dr. Christina McGahan
    Megan Dernberger

    • 111 Engineering Science Building

Get Access

Vanderbilt User Access
External User Access