Reactive Ion Etch Fluorine

Trion Phantom II ICP-RIE

Overview

RIE
Oxygen plasma generated in the Trion Phantom II reactive ion etcher. (Elena Kovalik, Valentine group)

The Trion Phantom II is a reactive ion etch tool for dry etching of dielectrics and semiconductors using fluorine etch chemistry. 

RIE

Capabilities

  • Process gases: CF4, CHF3, SF6, O2
  • ICP generator: 1250 W @ 13.56 MHz
  • RIE generator: 600 W @ 13.56 MHz
  • Substrate size: Up to 8 inch (200 mm) diameter
See All User Fees

Contact

  • VINSE Cleanroom

    VINSE Cleanroom

    Dr. Ben Schmidt, Manager

    Dr. Christina McGahan
    Megan Dernberger

    • 111 Engineering Science Building

Get Access

Vanderbilt User Access
External User Access