Multimode Deposition Chamber

Overview

Angstrom Multimode Deposition Chamber (left) and inside chamber (right)

The Angstrom Amod Multimode system is a versatile tool for physical vapor deposition (PVD) of thin films of insulators, semiconductors, and metals via electron beam evaporation, resistive thermal evaporation, or RF sputtering. Multiple source materials can be loaded into the 6-pocket, indexed e-beam hearth or 2-position resistive thermal section. RF sputtering is available from a single gun in sputter-up configuration, with additional gases available for reactive sputtering. Source materials can be deposited simultaneously in up to two resistive sources and one e-beam source with independent rate control and measurement for each source material. The deposition chamber can be opened to air or to a nitrogen glovebox with a spincoater, allowing coatings of air-sensitive samples such as organic films.

Capabilities

Multimode 2 — Chromium thermally evaporated onto a diced silicon wafer with a 300 nm layer of silicon dioxide to form an alignment grid for locating graphene flakes, camera image (left) and optical micrograph of grid (right).

Simultaneous operation of two resistive sources and one e-beam source available.

Current deposition materials:
- Electron beam evaporation: Fe, Ti, SiO₂, Al₂O₃, Ag, Ni, Au, Pt, Si, Pd
- Resistive thermal evaporation: Al, Cr
- RF sputtering: Ti, VO₂ (V target)
- Additional materials available upon request
Maximum sample size:
- Flat holder: 5 inch (14 cm) diameter
- Angled holder: 3 inch x 2 inch (8.4 cm x 5 cm)
Sample holders:
- Flat and angled (improved liftoff and fidelity of sub-micron features) sample holders available
- Holder rotation for high uniformity films available
- Holder Z translation: 9 inch (10 cm)
- Temperature range: liquid nitrogen-cooled to 800 ^oC
Deposition hardware:
- 2 resistive thermal evaporation sources
- 1 sputter gun in sputter-up configuration (sample sits at top of chamber)
- Ar and O₂ gases available for sputtering
- 6 pocket electron beam evaporation hearth with programmable beam sweep controller and crucible indexer
Film thicknesses controlled by quartz crystal microbalance in conjunction with manual or PID loop control
Chamber reaches 5e-6 Torr after a 30 minute pumpdown
Direct access to nitrogen glovebox with spincoater and to resistive deposition system for air-sensitive samples