Resistive Evaporator

Angstrom Amod Resistive Chambe

Overview

Resistive Evaporator - Angstrom Amod Resistive Chamber

The Angstrom Resistive system is currently used to deposit non-precious metals via resistive thermal evaporation. Source materials can be deposited simultaneously in up to three resistive sources with independent rate control and measurement for each source material. The deposition chamber can be opened to air or to a nitrogen glovebox with a spincoater, allowing coatings of air-sensitive samples such as organic films.

Capabilities

Resistive Evaporator - Angstrom Amod Resistive Chamber
Solar cells with aluminum top electrodes deposited using the Angstrom Resistive system.
  • Current deposition materials: Al and Cr
  • Additional materials available upon request
  • Maximum sample size: 55 inch (14 cm) diameter region (mounted on flat sample holder)
  • Sample holder features: rotation for high uniformity films available
  • 6 resistive thermal evaporation sources
    • Simultaneous operation of up to three resistive sources available
  • Film thicknesses controlled by quartz crystal microbalance in conjunction with manual or PID loop control
  • Chamber reaches 5e-6 Torr after a 25 minute pumpdown
  • Direct access to nitrogen glovebox with spincoater and to multimode deposition system for air-sensitive samples
Resistive Evaporator - Angstrom Amod Resistive Chamber
Interdigitated aluminum electrodes deposited onto silicon using the Angstrom Resistive system.
Resistive Evaporator - Angstrom Amod Resistive Chamber
Aluminum deposited onto a 3 inch silicon wafer using the Angstrom Resistive system.

Contact

  • VINSE Cleanroom

    VINSE Cleanroom

    Dr. Ben Schmidt, Manager

    Dr. Christina McGahan
    Megan Dernberger

    • 111 Engineering Science Building