Overview
![Microwave Plasma Asher](http://www.vanderbilt.edu/vinse/wp-content/uploads/sites/40/2024/03/microwave.jpg)
The PVA TePla IoN Wave 10 is a batch plasma system with applications in photoresist removal, wafer descum, and surface cleaning and activation. The device features a microwave component. This property provides more dense plasma and a lower induced bias voltage across a substrate relative to a standard RF plasma, enabling higher ashing rates and less severe plasma damage.
Capabilities
- Substrate size: up to 200 mm (8”) diameter
- Process gases: CF4, O2, Ar
- Microwave frequency/power: 1000 W @ 2.45 GHz
- Process pressure: 375 - 1125 mTorr
- Windows-based operating system
- Quartz chamber and chemical resistant seals
Contact
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VINSE Cleanroom
Dr. Ben Schmidt, Manager
Dr. Christina McGahan
Megan Dernberger- 111 Engineering Science Building