Grinder-Polisher

Buehler Ecomet 30

Overview

Equipment photo

The EcoMet 30 is a semi-automatic grinder and polishing system. Enabling both manual and semi-automatic polishing with common steps available via an easy to use touchscreen interface. The appropriate recipes can be used to polish samples to a mirror finish, making them ideal for SEM and FIB-SEM imaging and analysis.

Capabilities

  • Manual and Semi-Automatic Grinding and Polishing

Applications

  • SEM imaging
  • SEM-EBSD imaging
  • SEM-EDS analysis
  • Chip packaging removal
  • Metallurgy
  • Additive manufacturing
  • Mineralogy

Contact

  • Dr. James McBride

    Dr. James McBride

    VINSE Specimen Prep

    • 020 Engineering Science Building