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Do you need to make a device or structure?

Fabrication

Deposition Tools
SELECTIVE ADDITION OF MATERIALS FROM SOLID TARGETS, LIQUIDS, OR GASES
Metals:
- Multimode Deposition Chamber
- Resistive Deposition Chamber
- Sputter Deposition
- Sputter Coater (gold only)
- Focused Ion Beam Scanning Electron Microscope (FIB-SEM) (nanoscale targeted deposition of platinum)
- Electroplating System (nickel)
Insulators and Semiconductors:
Organics:
- Parylene: Parylene Coater
- Graphene: Tube Furnaces
  - Tube Furnace (1")
  - Tube Furnace (4")
- Process Hoods
Lithography Tools
PATTERNING MATERIALS AT VARIOUS FEATURE SIZES
Features > ~20um
- Photoplotter
- Patterns plastic film masks for use in mask aligner
Features > 3um
- Mask Aligner
Features > 1um
- Laser Writer
- Also patterns chrome glass masks for use in mask aligner
Features > 40nm
- Atomic Force Microscope (AFM)
Features > 20nm
- Electron Beam Lithography System (EBL)
Features > 5nm
- Focused ion Beam - Scanning Electron Microscope (FIB)
- Direct write into any substrate
Etching Tools
SELECTIVE REMOVAL OF MATERIAL USING WET OR DRY METHODS
Isotropic: Etches in all directions
- XeF2 Vapor Etch (Silicon, germanium)
- Process Hoods
- Microwave Plasma Asher
Anisotropic: Etches preferentially in one direction
- Metals:
  - Deep Reactive Ion Etch
  - Reactive Ion Etch Chlorine
- Semiconductors:
- Insulators:
  - Deep Reactive Ion Etch
  - Reactive Ion Etch Fluorine
Processing
CREATING, HANDLING, OR CHANGING YOUR MATERIAL'S PROPERTIES
Polishing: physically remove material to reduce surface roughness or to reveal buried layers or structures
- Using controlled force and user selected grits and slurries
- Buehler Ecomet 30
Annealing: use heat to reduce defects or remove volatile contaminants
- Rapid Thermal Processor (RTP)
- Standard Ovens
- Tube Furnaces - Lindberg Blue M (1”) and MTI OTF-1200X (4”)
Inert environment: perform work in air- and moisture-free environment for sensitive materials
Surface processing: remove contaminants and create reactive surfaces
- Plasma Cleaner
- UVO Ozone Cleaner
Nanoformulations
- NanoAssemblr
Packaging
PREPARATION OF INDIVIDUAL DIES
Separate substrates into smaller, individual dies at front or back end of processing
- Dicing Saw
Create wire connections from dies to external circuitry
- Wire Bonder
Nanoscale wire soldering
- Focused Ion Beam Scanning Electron Microscope (FIB-SEM)
3D Printing
RAPID PROTOTYPING OF 3-DIMENSIONAL OBJECTS
Larger minimum features and overall print size, with textured finish:
- 3D Printer (Filament)
Smaller minimum features and overall print size, with smooth surface finish:
- 3D Printer (Resin)

Do you need to image, measure, or analyze something?

Characterization

Film Thickness and Surface Topography
MEASURE THE THICKNESS AND ROUGHNESS OF SURFACE COATINGS, LAYERS, AND SUBSTRATES
Use a probe to physically measure height differences of surface features
- Stylus Profilometer (Analytical)
- Stylus Profilometer (Cleanroom)
- Atomic Force Microscope (AFM)
Observe sample interactions with polarized light and create models for properties (contactless)
- Spectroscopic ellipsometer
Image the cross section using electrons
Electrical Properties
UNDERSTAND HOW PROCESSING AFFECTS ELECTRICAL PERFORMANCE ON A VARIETY OF LENGTH SCALES
Sheet resistance, resistivity, and conductivity of thin films and bulk materials
- Four-Point Probe
Perform a variety of tests to measure current and capacitance
- Probe Station
Electrostatic Force Microscopy (EFM): electrostatic force detection, Kelvin Probe Force Microscopy (KPFM): local contact potential difference measurements
- Atomic Force Microscope (AFM)
Test solar cells under realistic conditions
- Solar Testing
Mechanical Properties
PROBE THE PHYSICAL RESPONSE OF SAMPLES TO STIMULI
Detect the response of a sample to force exerted by an indenting probe
- Atomic Force Microscope (AFM)
Molecular Composition
IDENTIFY MOLECULAR COMPONENTS AND DYNAMICS
Use different light sources to measure molecular signatures
Use heat to measure decomposition
- Thermogravimetric Analyzer (TGA)
Measure molecular binding on thin films
- Quartz Crystal Microbalance w/Dissipation Monitoring (QCM-D)
Elemental Analysis
IDENTIFY AND QUANTIFY ELEMENTAL COMPONENTS OF A SOLID SAMPLE
Use electrons to generate characteristic X-rays (EDS)
Crystalline Structure
DETERMINE THE ATOMIC ARRANGEMENTS OF A MATERIAL
Electron diffraction or high resolution TEM
- Transmission Electron Microscope (TEM)
Measure optical signatures of crystallinity
- Confocal Raman Microscope
- Fourier Transform Infrared (FTIR) Spectrometer
Use a scanning probe to measure surface atomic arrangements
- Atomic Force Microscope (AFM)
Particles
MEASURE PARTICLE SIZE, SIZE DISTRIBUTION AND OTHER PROPERTIES OF SUSPENSIONS TO POWDERS
In Solution
- Zetasizer
- Nanosight
Dispersed on a substrate
Visualization
USE DIFFERENT TECHNIQUES TO FORM IMAGES OF YOUR SAMPLE
Light Microscopes: rapid access to millimeter to micron scale with a variety of light sources
- Inspection microscopes with digital capture using visible or polarized light
  - Optical Microscopes
- Raman Microscopy
  - Chemical and crystallinity imaging at the micron scale using laser light
  - Confocal Raman Microscope
Electron Microscopes: use electrons in high vacuum to form images
- Scanning Electron Microscopy
  - High resolution imaging with electrons of sample surface and elemental composition down to the nanoscale
  - Scanning Electron Microscope (SEM)
  - Focused Ion Beam Scanning Electron Microscope (FIB-SEM)
- Transmission Electron Microscopy
  - Micron to atomic resolution imaging and elemental mapping of thin films and particles
  - Tecnai Osiris Transmission Electron Microscope (TEM)
Scanning Probe Microscopes: use a probe to image the sample surface
- Atomic Force Microscopy
  - Micron to sub-nanometer imaging of film thickness and topography with multiple modes and capabilities
  - Atomic Force Microscope (AFM)

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