Electroplating System

Silicon Valley Wafer Plating: Immersion-Beaker-on-a-Stick System

Overview

The Immersion-Beaker on a Stick system can deposit metal coatings on conductive substrates for applications such as electrodes or protective layers.  While electroplating is often recommended for films thicker than ~500 nm, thin films can be deposited as well.

Capabilities

  • Ni
  • Cu

Contact

  • VINSE Cleanroom

    VINSE Cleanroom

    Dr. Ben Schmidt, Manager

    Dr. Christina McGahan
    Megan Dernberger

    • 111 Engineering Science Building