We are excited to announce that DISCO Hi-Tech America, Inc. has joined the VINSE Industry Affiliates Program, becoming its inaugural member! DISCO Corporation, a renowned manufacturer of precision processing equipment and tooling, specializes in producing dicing saws and laser saws for cutting semiconductor silicon wafers and various materials. Additionally, DISCO offers grinders to process silicon and compound semiconductor wafers to ultra-thin levels, as well as polishing machines to enhance chip strength by removing the grinding damage layer from the wafer back-side. The DISCO DAD 3220 dicing saw in the VINSE Cleanroom is used extensively for cutting silicon, sapphire, glass, gallium nitride, and other materials.
Learn more about Disco Hi-Tech America here.